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Regardless of whether your design employs Ball Grid Arrays or
other Chip Scale Packaging, perhaps requiring advanced High Density Interconnects
in the form of blind and buried vias, or if your design needs controlled impedances,
or if your design is more of low-tech through-hole design we can develop the
mechanical and electrically innocuous circuit interconnects that will bring your design to life.
Cu Layer Inc. offers over 20 years of experience designing printed circuit
boards
for high-speed digital and analog circuits. We have experience with flexible
printed circuit boards (polyimide) too.
Please feel free to call or email us to talk about your particular circuit board needs or
to discuss circuit board design considerations in general.
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